Microelectronics International: Volume 41 Issue 2

CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED

Shanmugan Subramani, Mutharasu Devarajan

Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested…

Influence of extended surface area of heatsink on heat transfer: design and analysis

Shanmugan Subramani, Mutharasu Devarajan

Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in…

A monopole polarisation diversity antenna for high density packaging MIMO applications

Dhanalakshmi K.M., Kavya G., Rajkumar S.

This paper aims to propose a single element, dual feed, polarisation diversity antenna. The proposed antenna operates from 2.9 to 10.6 GHz for covering the entire ultra-wideband…

Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times

Xiangou Zhang, Yuexing Wang, Xiangyu Sun, Zejia Deng, Yingdong Pu, Ping Zhang, Zhiyong Huang, Quanfeng Zhou

Au stud bump bonding technology is an effective means to realize heterogeneous integration of commercial chips in the 2.5D electronic packaging. The purpose of this paper is to…

A modal analysis based optimal mounting support locations of a printed circuit board

Muthuram N., Saravanan S.

This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.

Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications

Imad El Fatmi, Soufyane Belhenini, Abdellah Tougui

The aim of this study is to make a contribution towards reducing the deflections of silicon wafers. The deformation of silicon wafers used in the manufacture of electronic…

Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy

Yidong Zhang

The purpose of this paper is to study the electronic transport performance of Ag-ZnO film under dark and UV light conditions.