Table of contents
A third‐generation circuit printing process
P.S.A. Evans, P.M. Harrey, D.J. Harrison, Z. BegumThis paper concerns a novel process for forming additive copper interconnect on flexible substrates via printing and plating processes. Building on the established conductive…
The applicability of electrodeposited photoresists in producing ultra‐fine lines using sputtered seeding layers
Paavo Jalonen, Aulis TuominenPhotolithographic techniques are universally employed in multi‐layer printed circuit board manufacturing. The growing demand for miniaturization of electronics means that finer…
Development of a standard test method for evaluating conductive anodic filament (CAF) growth failure in PCBs
Clarissa NavarroIncreasing board densities, decreasing spacing between holes and features and the growing requirement for printed circuit boards to perform in high temperature/high humidity…
The production of large format backplanes—part 1
Gary MorseReviews the equipment and processing challenges involved in the initial stages of the manufacture of large area back plane printed wiring boards and describes some of the…
Direct legend printing (DLP) on printed circuit boards using piezoelectric inkjet technology
Kim Clay, Ian Gardner, Eric Bresler, Mike Seal, Stuart SpeakmanThe industry standard for applying the identification nomenclature to Printed Circuit Boards (PCBs) is silkscreen legend printing, using white ink. This multi‐step process has…
Analysis and comparison of WLCSP‐on‐build‐up PCB assemblies with various solders and microvia configurations
S.‐W. Ricky Lee, John H. LauIn this paper, a computational analysis is presented for the comparison of wafer level chip scale package‐on‐build‐up PCB assemblies with various solders and microvia…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari