Circuit World: Volume 31 Issue 3

An overview of digital printing for advanced interconnect applications

To review the concept of digital imaging for PCB manufacturing, with a specific focus on ink‐jet printing technologies.

A software tool for estimation of PCB substrate utilisation efficiency statistics from scanned images

Routing efficiency provides an estimate of the compactness of a specific PCB layout in comparison with the theoretical minimum size for the circuit design. This work describes a…

SAVIA, an advanced multi‐layer parallel lamination technique for high density, high performance printed circuit boards

To review a newly developed PCB fabrication process based on a parallel lamination technique.

New technologies for a sustainable printed circuit board manufacturing process: initial results

To present the initial results from a project recently undertaken by Rohm and Haas Electronic Materials Europe Ltd, in collaboration with a number of European partners, to develop…

Environmental and economic implications of a shift to halogen‐free printed wiring boards

To present the outcome from one case study in the EU project grEEEn (Cost Management System for greening Electrical and Electronic Equipment). The study addressed the material…

Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys

To study the influence of storage time and environment on the solderability of electroless nickel plated samples with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solders and to provide…

Soldering considerations for lead‐free printed circuit board assembly – an Envirowise Guide

To give an overview of the issues encountered, and changes that need to be made in the various types of soldering process when converting them from conventional to lead‐free…

LAMAR changes laminate source

ISOLA Group completes European restructuring plan

Internet commentary

Lead-free and RoHS developments in China

AT&S selects Camtek's Dragon with Kuttler's material handling for fully automatic optical inspection lines

Market and government forces

Legislation update

Planar Microwave Engineering: A Practical guide to Theory, Measurement and Circuits

New DuPont™ Zytel® HTN resins smooth the path to lead-free circuit assembly

International diary

SMART group present cheque to MND Charity

Stuart Down Heads Coa Tes Circuit Products in North America

Editorial

AvW Group gains Oblak for Management

NPL seeks partners for new reliability project for lead-free processed substrates

Soldertec Global announces winners of Lead-Free Solder Awards 2004

Are electronics companies on target for lead-free RoHS deadlines?

DTI Faraday Mini-Waste Members secure additional funding to develop new advanced oxidation technology

ACI waterborne photoresists to be assessed

Orbotech receives major order from LG Electronics for PCB manufacturing operation

Starting Electronics

Excellon Automation announces the release of its Concept 129 Precision Driller/Router

IPC's Government Relations Steering Committee made stronger with addition of two industry leaders

Chris Milton appointed general manager for Rohm & Haas Circuit Board Technologies in Europe

Huub van Dun appointed president of Enthone Inc.

Rohm and Haas announces corporate gift for Tsunami survivors