Table of contents - Special Issue: Pb free – time to prepare
Stencil design for mixed technology through‐hole/SMT placement and reflow
William E. Coleman, Denis Jean, Julie R. Bradbury‐BennettReviews stencil design requirements for printing solder paste around and in through‐hole pads/openings. There is much interest in this procedure since full implementation allows…
A study of solder paste printing requirements for CSP technology
Jeff KennedyThis paper describes the methodology used to evaluate several different stencil fabrication methods, aperture sizes and thicknesses and different solder pastes. Data collected…
The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT
Qinong Zhu, Mei Sheng, Le LuoThe effects of Pb contamination on the microstructure and shear strength of lead‐free solder joints with non‐lead containing finishes on both the PCB and terminals of 1,206 chip…
On the degradation of the solder joints of underfilled flip chip packages: a case study
Zhang Qun, Xie Xiaoming, Chen Liu, Wang Guozhong, Cheng Zhaonian, Wolfgang KempeThe lifetime of flip chip solder joints can be greatly increased by applying underfill encapsulation. This paper presents a case study where the thermal cycle lifetime was…
Development and validation of lead‐free wave soldering process
Atso Forstén, Hector Steen, Ian Wilding, Jürgen FriedrichThough lead‐free replacements for SnPb eutectic alloys for reflow, wave, and hand soldering have been developed, relatively little has been reported on practical experience of…
Rework of CSP: the effect on surface intermetallic growth
T.A. Nguty, N.N. Ekere, J.D. Philpott, G.D. JonesHigh‐density packaging devices have unique characteristics which make their assembly, test and repair very difficult. The only realistic method of rework is to replace the…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang