Soldering & Surface Mount Technology: Volume 14 Issue 1

Correlation of solder paste rheology with computational simulations of the stencil printing process

Soldering technologies continue to evolve to meet the demands of the continuous miniaturisation of electronic products, particularly in the area of solder paste formulations used…

Solder paste reflow modeling

Solder paste printing and reflow are well established processes for producing solder joints in electronic assemblies. Solder paste consists of a dense suspension of solder…

Numerical modelling of scanned beam laser soldering of fine pitch packages

Laser soldering provides a useful tool for the electronics manufacturer and has found a number of successful industrial applications. The laser provides highly controllable…

A simplified model of the reflow soldering process

Previous models of temperature development during the reflow soldering process have typically used commercially available, general purpose, finite difference/finite element…

CFD modelling of the flow field inside a reflow oven

Because of new requirements related to the employment of lead‐free manufacturing and the diversity of components and metal finishes on high density printed circuit boards, better…

Analysis on solder ball shear testing conditions with a simple computational model

This paper introduces a simple computational model for the analysis on the solder ball shear testing conditions. Both two‐dimensional (2‐D) and three‐dimensional (3‐D) finite…

Optimisation modelling for flip‐chip solder joint reliability

This paper details and demonstrates integrated optimisation‐reliability modelling for predicting the performance of solder joints in electronic packaging. This integrated…

IPC-VT-42/43 hand soldering for through-hole components

Dexter introduces 260°C reflow silver-filled conductive adhesive

EKRA announces the release of the E5-36 large format in-line sten

New thin bondline, thermal interface material

New printers from Reprint

The SMART group environmental electronics seminar

Selective soldering system from Vitronics Soltec

Focus is on the Hawk

SMTA.Third technology symposium to be held at SMTA Boston 2002

New electronics coating lowers cost of moisture protection for PCBs

ems – ALLIANCE the new concept for electronics manufacturing

New man at the helm for X-Tek

New alliance in the SMT arena

Tecnomatix-Unicam expands executive team

Internet commentary

Environment-friendly Electronics: Lead-free Technology

New standard published in the BS-7000 series

New convertible head flip chip bonder

Loctite multicore introduces anti-tombstoning solder pastes formulated with 63S4 alloy

International diary

IC-SCAN DE tracks MSDs for double side reflow boards

Fifth SMART group european conference 2002announced

Test jig boosts productivity for users of surface-mount feeders

Pyramax lowers cost of ownership

SMTA.Pan pacific microelectronics symposium preliminary program announced

High-performance stencils for vector™ and tetra™ frames

Multicore solders introduces new lead-free no-clean solder cream for SMT assembly

Editorial

Oxford Instruments Analytical extends product range to include coating measurement instruments

The National Physical Laboratory celebrates the strength of UK measurement through national awards

A new CEO for Instem Technologies

A range of new chemicals