Table of contents - Special Issue: Lead free and lead bearing solders
Lead‐free solder process implementation for PCB assembly
Peter Collier, Vasudivan Sunappan, Arulvanan PeriannanA challenge in selecting and applying lead‐free solders lies in separating the influences of materials' properties, fluxes and processes to obtain robust assembly conditions that…
Evaluation of two novel lead‐free surface finishes
Richard Ludwig, Ning‐Cheng Lee, Chonglun Fan, Yun ZhangTwo new electrolytically plated lead‐free surface finishes are evaluated for their wettability, bond strength, and voiding performance, and are compared with electrolytic nickel…
Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packages
L.C. Shiau, C.E. Ho, C.R. KaoThe reactions between Sn–Ag–Cu lead‐free solders of various compositions and Au/Ni surface finish in advanced electronic packages were studied. Three solder compositions…
Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder
C. Kanchanomai, Y. Miyashita, Y. Mutoh, S.L. MannanLow cycle fatigue tests on as‐cast Sn–Ag eutectic solder (96.5Sn–3.5Ag) were carried out using a non‐contact strain controlled system at 20°C with different frequencies (10−3…
Fatigue crack growth behaviour of lead‐containing and lead‐free solders
Y. Mutoh, J. Zhao, Y. Miyashita, C. KanchanomaiFatigue crack growth (FCG) tests on lead‐containing solders and lead‐free solders have been carried out at frequencies ranging from 0.01 to 10 Hz and stress ratios in the range…
Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders
Shi‐Wei Ricky Lee, Ben Hoi Wai Lui, Y.H. Kong, Bernard Baylon, Timothy Leung, Pompeo Umali, Hector AgtarapEvaluates the board level reliability of plastic ball grid array (PBGA) assemblies under thermal and mechanical loading, with the objective of characterizing the reliability of…
Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests
P. Towashiraporn, G. Subbarayan, B. McIlvanie, B.C. Hunter, D. Love, B. SullivanAims to show that with careful modelling, the fatigue life of solder joints of identical geometry and microstructure can be predicted very accurately (through empirical…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang