Table of contents
Investigation of a solder bumping technique for flip‐chip interconnection
David A. Hutt, Daniel G. Rhodes, Paul P. Conway, Samjid H. Mannan, David C. Whalley, Andrew S. HolmesAs the demand for flip‐chip products increases, the need for low cost high volume manufacturing processes also increases. Currently solder paste printing is the wafer bumping…
Reliability of unencapsulated SMD plastic film capacitors
Anne Seppälä, Kimmo Saarinen, Eero RistolainenSmall and low cost unencapsulated SMD plastic film capacitors were manufactured with different terminal metal compositions and dielectric materials. Capacitors made with a…
An alternative approach for the analysis of intermetallic compounds in SMT solder joints
I.K. Hui, H.W. LawIn a properly wetted joining system, with tin/lead solder as the filler and copper as the base metals, a layer of intermetallic compounds is usually found at the interface of…
Lead‐free solders in Japan (a personal impression)
W.J. PlumbridgeImpressions gained from two visits to Japan, discussing with representatives of industry and academe the current status regarding the implementation of lead‐free technology, are…
3D Si‐on‐Si stack packaging
H. Kanbach, J. Wilde, F. Kriebel, E. MeuselA new concept of 3D‐electronic packaging is presented: Si‐on‐Si multi‐chip module flip‐chip technology with arrays of fine etched and filled vertical electrical interconnections…
A novel high performance die attach
X.M. Xie, T.B. Wang, J.Z. Shi, R.Q. Ye, F. Stubhan, J. FreytagAu/In isothermal solidification technique was evaluated as an alternative method for high performance die attachment. Bonding could be achieved at temperatures between 250°C …
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang