Table of contents
Embedded passive components and PCB size – thermal effects
D.M. Stubbs, S.H. Pulko, A.J. Wilkinson, B. Wilson, F. Christiaens, K. AllaertThe embedding of passive components such as resistors, capacitors and inductors within printed circuit boards (PCBs) is motivated, to a large extent, by the desire for increased…
Packaging of closed chamber PCR‐chips for DNA amplification
C.G.J. Schabmueller, A.G.R. Evans, A. Brunnschweiler, G. Ensell, D.L. Leslie, M.A. LeeReports the design, fabrication and packaging of a micromachined silicon/Pyrex based chip for the polymerase chain reaction (PCR). The anodic bonding method is used for sealing…
Assembly issues in three flip chip processes
Zhaowei ZhongDiscusses three simple and low‐cost flip chip assembly processes. First, flip chip on board using non‐conductive adhesive is evaluated. This process can give reasonable…
Advances in microwave MCM‐D technology
Philip Pieters, Walter De Raedt, Eric BeyneThe thin film multilayer multichip module technology (MCM‐D) was originally used for the interconnection of high speed digital circuits in a single module. Nowadays, the…
Wafer level packaging of compliant, chip size ICs
Joseph Fjelstad, Thomas DiStefano, Anthony FaraciThe concept of packaging integrated circuits while they are still in wafer form has captured the imagination of semiconductor manufacturers and packagers around the globe. One…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson