Table of contents
Flexible circuitry ‐ technology background and important fundamental issues
Joseph Fjelstad“A patterned arrangement of printed wiring utilizing flexible base material with or without flexible coverlayers”. The balance of this brief article will hopefully serve to help…
High volume, low cost flip chip assembly on polyester flex
Ken Gilleo, Bob Boyes, Steve Corbett, Gary Larson, Dave PricePolymer thick film (PTF) technology provides the lowest cost, cleanest and most efficient manufacturing method for producing flexible circuits. Non‐contact radio frequency (RF…
Evaluation of Ni/Pd/Au as an alternative metal finish on PCB
Zequn Mei, Ali EslambolchiMulti‐layer surface finish, from the bottom to top, of electroless Ni, electroless Pd, and immersion Au (Ni/Pd/Au) have been introduced in the printed circuit board (PCB) industry…
Thermal cycle reliability of solder joints to alternate plating finishes
R. Wayne Johnson, Vicky Wang, Michael PalmerStudies immersion gold over electroless nickel, immersion gold over electroless palladium, immersion gold over electroless palladium over electroless nickel, immersion gold over…
Optimizing BGA to PCB interconnections using multi‐depth laser drilled blind vias‐in‐pad
Larry W. Burgess, Fabrizio PauriBall grid array (BGA) component packages challenge the circuit board design with signal routing and layout, creating in some cases extra board layers and added vias all resulting…
Limits of copper plating in high aspect ratio microvias
Steve Castaldi, Dennis Fritz, Ron SchaefferThis paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.
Design, analysis and measurement of the cost‐effective substrate of a plastic ball grid array package ‐ NuBGA
John H. Lau, Tony Chen, Tai‐Yu ChouA family of cavity‐down plastic ball grid array (PBGA) packages have been designed by split via connection (SVC) and split wrap around (SWA) methods. Because of the special…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari