Table of contents
Finite element modeling to analyze durability of BGA/CSP connections during thermal shock
Subhotosh Khan, Dan J. MolliganPersonal electronic devices at the user interface, like cell phones, utilize BGA/CSP structure for miniaturization of circuits. These structures are subjected to severe thermal…
The use of statistical experimental design for PCB process optimisation
David AlbinStatistical experimental design (SED) can be used as an analytical tool to investigate the effect of a range of PCB processing parameters (variables) on certain final properties…
Low cost HDI multilayers – the power mesh architecture
Happy HoldenThis paper describes the power mesh architecture (PMA), a new interconnection topology which leverages the production technologies of microvias, via‐in‐pads and fine‐line…
Integrated passives in advanced printed wiring boards
Stephen O’Reilly, Maeve Duffy, Terence O’Donnell, Paul McCloskey, Seán Cian Ó MathúnaThis paper will focus on the work which was carried out under the Brite‐EuRAM funded project, COMPRISE (BE 96‐3371), the objective of which was to develop new materials and…
Asia: the growth engine for the world electronics industry over the next 20 years
Shiuh‐Kao ChiangGives an account of recent trends in the electronics industry and makes predictions for the next 20 years.
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari