Table of contents
Use of Organic Metal to enhance the operating window and solderability of immersion tin
Bernhard WesslingAs an alternative to hot air levelling, a fundamentally new surface finish chemistry and process for solderability preservation of printed circuit boards is described: a…
New normal‐propyl bromide based cleaning technology for the electronics industry
Suae‐chen Chang, Ronald L. ShubkinPrecision cleaning with solvent systems based on n‐propyl bromide (nPB) has become an important component of the circuit board fabrication process. The nPB‐based cleaners have…
The constraints of vias and layers and their impact on PCB design strategy
P.J. Palmer, D.J. WilliamsThis paper explores the use of models of substrate behaviour to examine the wireability constraints on PCBs due to signal layers and buried and through vias. The importance of…
Optimal printed wiring board design for high I/O density chip size packages
Chirag S. Patel, Kevin P. Martin, James D. MeindlThis paper addresses the issues involved in the design of high‐density boards for high‐density chip scale packages. An analytical model is developed to calculate the number of…
Controlling emissions stemming from the hot air solder leveling process
Matthew A. LeeThe oil, flux, and solder added to a hot air solder leveling tool creates an emission of oil mist, acidic gases, and solid metal compounds. The oil tends to form into very fine…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari