Table of contents
Evaluation of pre‐deposited (no‐flow) underfill for flip chip and CSP assembly
M.G. Firmstone, P.M. Bartholomew, D.J.J. Lowrie, S.H. Mannan, D.A. HuttThe benefits of a “no flow” process have been well documented in the recent past. The limitations of the previously reported materials in current use have been overcome via a…
Optimizing the reflow profile via defect mechanism analysis
Ning‐Cheng LeeA reflow profile is proposed which is engineered to optimize soldering performance based on defect mechanism analysis. In general, a slow ramp‐up rate is desired in order to…
Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests
Aulis Tuominen, Eero Ristolainen, Ville LehtinenOwing to the incessant demand for reductions in the size of portable electronics, new dense packaging technologies are required. Reflow soldering is still mainly used for…
An evaluation of the effect of ageing on the cleanability of solder flux residues
L. Zou, M. Duˇsek, C.P. Hunt, B.D. DunnThe efficiency of cleaning of flux residues after various periods of ageing was assessed by measuring the ionic contamination removed in an Ionograph 500 SMD. The flux residues…
The impact of temperature and humidity conditions on surface insulation resistance values for various fluxes
Christopher Hunt, Ling ZouThe surface insulation resistance (SIR) test has traditionally been performed by taking measurements at certain points during a seven‐day test under well established environmental…
Solder joint reliability of plastic ball grid array packages
Chong Hua Zhong, Sung YiPresents the results of a study of the effects of solder ball pad metallurgy, intermetallic compound (IMC) thickness and thermal cycling on the shear strengths of PBGA package…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang