Table of contents
An overview of surface finishes and their role in printed circuit board solderability and solder joint performance
Paul T. ViancoAn overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability…
Reliability comparison of different surface finishes on copper
Shelgon Yee, Harjinder LadharThis paper focuses on the comparative study on reliability performance of various surface coatings. Only brief descriptions of coating processes, material physical properties…
A unique electroplating tin chemistry
Yun Zhang, Joseph A. AbysA novel tin electrodeposition chemistry and process has been developed at Bell Laboratories, Lucent Technologies, New Jersey, USA. This process produces smooth, satin bright tin…
18 μm electrodeposited copper foil for flex fatigue applications
Harish D. Merchant, Melvin G. Minor, Sid J. Clouser, Dan T. LeonardThe strain‐based flex fatigue of 18 μm thick copper foil is evaluated over a wide range of strain amplitudes. Seven electrodeposited foils, four commercial grades and three…
A new small CTE system from COPNA resin/E‐glass fabrics
Kazunari Nawa, Masakazu OhkitaBased on the superior properties of the COPNA resin laminate exhibiting Tg at 255∞C, small CTE at 5‐7 ppm (xy‐axis) and at 29 ppm (z‐axis), reliability of both two‐layered and…
An understanding of the structure and geography of the subcontract PCB industry in the UK
Cy Hughes, David J. Williams, Terry EdwardsThis paper examines the make‐up of the subcontract printed circuit board industry in the UK and identifies the geographical location of manufacturing sites together with the…
Surface evaluation of the silver finishes via sequential electrochemical reduction analysis (SERA)
P. Bratin, Michael Pavlov, Gene ChalytThis paper extends our study of the sequential electrochemical reduction analysis (SERA) technique for evaluation of various alternative finishes and it discusses the application…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari